From decwrl!athertn!sander.cupertino.ca.us!paul@cs.purdue.edu Tue Jan  5 12:40:44 EST 1993
Submit chipset-2 00/10 
Hi folks,

This is my revised submission to comp.sources.reviewed of the Software
ChipSet reusable software components.  Most of the reviewers' comments
have been incorporated, a couple of minor bugs were repaired, and some
additional minor enhancement were made.  Below is a list of the specific
changes that were made.

Paul
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Changes since the last release:
- Added unpacking and build instructions.
- Added a "verify" target to the top-level makefile that verifies that the
  package unpacked properly.
- Documented the build scaffolding and procedures for adding new components
  to the package.
- Rewrote the build scaffolding so that all configurable options are collected
  into one file, and default rules are collected into another common file.
- Added aliases for the "spotless" target.  These now include "clobber",
  "veryclean", and others.
- Documented the target systems in the ChipSet file.
- Added notices to each of the source code files explaining their status in
  the public domain.
- Added several more redistribution media (compressed tar and cpio archives,
  also zip archives).
- Modified the shar unpacking instructions to recommend editing the common.mk
  file prior to performing a "make all".
- Bumped the patchlevels.
- Added comment headers describing the purposes of the btpriv.h, btree.h,
  dlist.h, and dlpriv.h files.
- Repaired bugs in the termination conditions of the B-tree and list test
  programs.