79R3041 Product Change Notice
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 Number   Document                                       Size      Revision Date
 7302     PCN# G9911-05, To qualify low alpha             45 KB    11/18/1999
          mold compound.
 7470     PCN# G0106-01, Moisture Sensitive              275 KB    06/11/2001
          Label Change
 7801     PCN# G-0110-06 Mold Compound                    48 KB    12/14/2001
 7988     PCN# G-0203-05 Mold Compound                    41 KB    04/16/2002
 7987     PCN# G-0110-06 REV.1 Mold Compound              49 KB    04/26/2002
 8105     PCN: I0206-04 Wafer Fab Transfer,               12 KB    06/14/2002
          Fab 2 to Fab 4
 8114     PCN# G-0206-08, Orientation of                 151 KB    06/17/2002
          square PQFP & TQFP
 8675     PCN#:G-0303-01, new m/c G700 & 3230            139 KB    03/11/2003
          d/a material
 8677     PCN#G-0302-05, New mold compound                66 KB    03/20/2003
          EME-G700 series
 8678     PCN#: G-0302-06, New die attach 3230           151 KB    03/20/2003
          from Ablestik
 9030     PCN#: A-0309-04, new mold compound             135 KB    10/07/2003
          G600 material
 10119    PCN#: A-0310-01, Green Products                 27 KB    10/10/2003
 10106    PCN#: A-0410-02, Change IDT marking logo        25 KB    10/08/2004
          with new IDT gridless w
 10348    PCN#: A-0412-04 - To comply with Pb-free        81 KB    12/14/2004
          labels - Green Products
 10733    PCN A-0506-03; Packing Material Change         291 KB    07/19/2005
 11178    PCN#: TB-0512-01 Reel Color Changed            730 KB    12/16/2005
          from Blue to Black
 4045756  A-0603-04 Transfer TQFP and PQFP from          165 KB    05/10/2006
          ASAT HK to ASAT China
 9859310  PCN# A-0607-06 MMT Thailand as Alternate       223 KB    10/06/2006
          Assembly Facility for PLCC, SOIC 150mil/300mil
 10504787 PCN# : A-0610-02 ASAT China as Alternate       253 KB    10/19/2006
          Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP
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